Reduces deformation due to heat. Excellent chemical resistance and suitable for various surface shape processing.
Single-wafer polishing plate with high thermal conductivity, low coefficient of thermal expansion, high Young's modulus, excellent heat uniformity, and minimal plate deformation due to heat. It also has excellent chemical resistance and can be processed into various shapes, such as convex, concave, and flat, for plate surface processing.
Keywords: high Young's modulus, low thermal expansion, high thermal conductivity, chemical resistance, uniform temperature
|SiC Polishing Plate|
|Material||Silicon carbide (SiC)|
|Shape||Convex, concave, and flat surfaces are available|
|Accuracy||Flatness 1 μm or less|
|Application example||Wafer fixing jig|